Semiconductor Assembly and Packaging Equipment Market to Reach USD 8.48 Billion by 2034, Driven by AI Integration, 5G Expansion, and Advanced Chip Packaging Technologies
The global semiconductor assembly and packaging equipment market is poised for significant expansion over the next decade. Valued at USD 3.62 billion in 2024, the market is projected to reach USD 8.48 billion by 2034, growing at a robust CAGR of 8.92% during the forecast period from 2025 to 2034, according to the latest industry analysis. This growth...
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