Market Overview / Summary The global semiconductor assembly and packaging equipment market size was valued at USD 3.62 billion in 2024, growing at a CAGR of 8.92% from 2025 to 2034. The global semiconductor assembly and packaging equipment market is witnessing rapid growth, driven by the expanding semiconductor industry, increasing demand for advanced electronic devices, and the ongoing...

The global semiconductor assembly and packaging equipment market is poised for significant expansion over the next decade. Valued at USD 3.62 billion in 2024, the market is projected to reach USD 8.48 billion by 2034, growing at a robust CAGR of 8.92% during the forecast period from 2025 to 2034, according to the latest industry analysis. This growth...

The U.S. semiconductor assembly and packaging equipment market is on a promising growth trajectory, expected to expand from USD 439.24 million in 2024 to USD 825.84 million by 2034, growing at a CAGR of 6.53% over the forecast period. The growth is being fueled by significant government initiatives to bolster domestic chip production, advancements...